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Introduction:
As part of preparation of sampling substrates for further experimentation, Poly (4-vinylpyridine) Spin coating utilizes spin coating techniques in order to attach the polymer 4-vinylpyridine (P4VP) to substrate silicon wafers of dimensions 2 cm x 2 cm. And thus, the P4VP behaves as a thin film because of which further experimentation in the fabrication of polymer nanostructures can be pursued.
Purpose:
Spin Coating provides a viable way to attach P4VP to the silicon wafer substrate as a thin film.
Preliminary Setups
The required materials are a beaker, wafers, P4VP.
Preparing the solvent (polymer): Place a bottle of P4VP (10 g/mL) into a beaker containing 25 mL of distilled water. And then place this into a sonicator for 5 to 10 minutes at room temperature. This should mix the solvent completely.
Preparing the Silicon Wafer: Apply a small piece of scotch tape to the corner of three silicon wafers. This will aid in measurement of the thin film layer produced by the P4VP.
Spin Coating Process with 2cm x 2cm Silicon Wafers:
The following process uses a Laurell Technologies spin coater, 2 cm x 2cm silicon wafers, P4VP, tweezers, and acetone. Set the spin coater to a spin speed of 2000 rpm for 60 seconds.(Click F1 to change the settings. Use ↑↓ to change the value of setting, and use ←→ to change the condition, shown in Figure 2). Using acetone, clean the chuck of the spin coater manually. Carefully pick up a clean wafer from the Petri dish and place onto the center of the chuck (Caution: Use only one corner to move the wafer to prevent damage.). Turn vacuum on (DO NOT ADD acetone if chemical etching was already performed). Add 5-6 droplets of P4VP onto wafer so as to cover the entire surface. It is allowed to spread and reach the edge of the wafer. After the spin rate and time are set, the lid is closed to run the spin coat process (shown in Figure 3). The run button is pushed to start the spin process. After spin coating is completed, turn vacuum off and move wafer to the side of the chuck using the back of the tweezers. Carefully (using the same corner used to place the wafer) place the spin coated wafer back into the Petri dish. Repeat this process for multiple wafers. At completion, clean the chuck with acetone.
As part of preparation of sampling substrates for further experimentation, Poly (4-vinylpyridine) Spin coating utilizes spin coating techniques in order to attach the polymer 4-vinylpyridine (P4VP) to substrate silicon wafers of dimensions 2 cm x 2 cm. And thus, the P4VP behaves as a thin film because of which further experimentation in the fabrication of polymer nanostructures can be pursued.
Purpose:
Spin Coating provides a viable way to attach P4VP to the silicon wafer substrate as a thin film.
Preliminary Setups
The required materials are a beaker, wafers, P4VP.
Preparing the solvent (polymer): Place a bottle of P4VP (10 g/mL) into a beaker containing 25 mL of distilled water. And then place this into a sonicator for 5 to 10 minutes at room temperature. This should mix the solvent completely.
Preparing the Silicon Wafer: Apply a small piece of scotch tape to the corner of three silicon wafers. This will aid in measurement of the thin film layer produced by the P4VP.
Spin Coating Process with 2cm x 2cm Silicon Wafers:
The following process uses a Laurell Technologies spin coater, 2 cm x 2cm silicon wafers, P4VP, tweezers, and acetone. Set the spin coater to a spin speed of 2000 rpm for 60 seconds.(Click F1 to change the settings. Use ↑↓ to change the value of setting, and use ←→ to change the condition, shown in Figure 2). Using acetone, clean the chuck of the spin coater manually. Carefully pick up a clean wafer from the Petri dish and place onto the center of the chuck (Caution: Use only one corner to move the wafer to prevent damage.). Turn vacuum on (DO NOT ADD acetone if chemical etching was already performed). Add 5-6 droplets of P4VP onto wafer so as to cover the entire surface. It is allowed to spread and reach the edge of the wafer. After the spin rate and time are set, the lid is closed to run the spin coat process (shown in Figure 3). The run button is pushed to start the spin process. After spin coating is completed, turn vacuum off and move wafer to the side of the chuck using the back of the tweezers. Carefully (using the same corner used to place the wafer) place the spin coated wafer back into the Petri dish. Repeat this process for multiple wafers. At completion, clean the chuck with acetone.
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