As the advanced device technology is improving the quality of the MOSFET has become much better than older one. From this seminar I learned that there are three major way to consider the producing process in future devices.
• Function: Design future; Nano-relay architecture; Key photonic elements
• Density: System in package; Vertical
• Power: Wire/ Dots; TFETS; Spin-Torque Architecture
In this seminar, the most interesting thing for me is to get more information in MOSFET, which has several applications during the design process. For example, in the same design area with thin and light component product designer can have more space to produce more products. Just like Frynman state, there’s plenty of room at the bottom. I totally agree with the speaker’s ideas because we can change from bottom-up to top-down design to make those advance devices. Moreover, to think about the advantages and disadvantages of those major defining axes for future device improvements is also very important.
If I can ask a question, I would like to know when they face the challenge among function, density, and power at the same time, which one they will choose to be the main issue.
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